Spring Finger

Features/Benefits

• Ultra thin construction

• Solderless

• High performance in drop test

• Reduced space on PCB

Typical Applications

• Cell phones

• Medical

• MP3 player

• Audio headsets

• Automotive

Construction (typical)

1. FUNCTION: Momentary action

2. CONTACT ARRANGEMENT: Normally open

3. CONNECTIONS: Spring Finger

4. MOUNTING: Springloaded

Mechanical (typical)

1. MAXIMUM ACTUATION FORCE: 20 N (4.4 lbs.)

2. OPERATING FORCE/LIFE/TRAVEL:

3. Actuation Force: 2 N ± 50%

4. Life Expectancy: 100,000 operations

5. Travel to Make: 0.15 mm+0.15/-0mm

6. Total Travel: 0.45 mm

Electrical (typical)

1. MAXIMUM POWER: 1 VA(Silver) ; 0.2 VA(Gold)

2. MAXIMUM VOLTAGE: 32 V(Silver) ; 32 V(Gold)

3. MAXIMUM CURRENT DC: 50 mA(Silver) ; 10 mA(Gold)

4. MINIMUM CURRENT DC: 1 mA(Silver) ; 1 mA(Gold)

5. DIELECTRIC STRENGTH: 250 vrms

6. CONTACT RESISTANCE: ≤500 mΩ

7. INSULATION RESISTANCE (100 VDC): 10⁹ Ω

8. BOUNCE TIME: < 5 ms

Environmental (typical)

1. OPERATING TEMPERATURE: –40?C to +85?C

2. STORAGE TEMPERATURE: –55?C to 125?C